Description

This product utilizes the 5th generation of design rules of ST’s proprietary STripFET™ technology. The lowest available RDS(on)*Qg, in this chip scale package, makes this device suitable for the most demanding DC-DC converter applications, where high power density is to be achieved.

Features

■ Ultra low top and bottom junction to case thermal resistance

■ RDS(on) * Qg industry benchmark

■ Extremely low on-resistance RDS(on)

■ Very low switching gate charge

■ Fully encapsulated die

■ 100 matte tin finish (in compliance with the 2002/95/EC european directive)

■ High avalanche ruggedness

■ PolarPAK® is a trademark of VISHAY

Application

■ Switching applications