Features

Includes ST state-of-the-art patented technology.

Module content

• All-in-one Wi-Fi/Bluetooth® LE/802.15.4 wireless microcontroller

• Embedded 40 MHz high-precision crystal

• All RF components for transmission and reception matching network, including

antenna filter

• Three variants: embedded antenna (-B version), RF connector (-U version), RF

pin output (-P version)(1)

Standard

• IEEE 802.11b/g/n/ax

• Bluetooth® LE 5.4

• IEEE 802.15.4 (Thread)(1)

Wi-Fi

• Wi-Fi 6, 2.4 GHz RF transceiver

Wi-Fi 20/40 MHz bandwidth, 1T1R

Wi-Fi security WPS(1)/WEP/WPA/WPA2/WPA3

• STA, SoftAP, concurrent STA + SoftAP

• Maximum Tx power: 21 dBm

• Tx power (HE40 and MCS9): 16 dBm

• Rx sensitivity (HE40 and MCS9): -67 dBm

• Application throughput up to 17 Mbps (TCP)

• LDPC, STBC, beamforming, DL/UL OFDMA, MU-MIMO, target wake time

(TWT)(1), spatial reuse (SR), dual carrier modulation (DCM), extended range

(ER)

• A-MPDU, A-MSDU, immediate block ACK, fragmentation, and defragmentation

Bluetooth® LE

• Maximum Tx power:

– Bluetooth® LE (2 Mbps): +10 dBm

– Bluetooth® LE (1 Mbps): +10 dBm

• Rx sensitivity

– Bluetooth® LE (2 Mbps): -96.5 dBm

– Bluetooth® LE (1 Mbps): -99 dBm

System peripherals

• SPI

• UART

Security

• PSA Level 1 certified

• Security system encryption engine

• Secure services: Secure boot and OTA (over-the-air)

Voltage

• Input voltage: 2.97 V ~ 3.63 V

• I/O voltage: 1.8 V/3.3 V

Environmental specifications

• Temperature:

– Operating: -40°C ~ +85°C

– Storage: -40°C ~ +125°C

• Humidity:

– Relative: < 90% noncondensing

– Storage: < 90% noncondensing

1. This feature is not yet available.

All packages are ECOPACK2 compliant.