Features

• AQG 324 qualified

• Half-bridge power module

• 650 V blocking voltage

• Fast recovery body diode

• Very low switching energies

• Low package inductance

• Dice on direct bond copper (DBC) substrate

• Low thermal resistance

• Isolation rating of 3.4 kVrms/min

Description

This device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT

is a very compact and rugged power module in a surface mount package for easy

assembly. Thanks to the DBC substrate, the ACEPACK SMIT package offers low

thermal resistance coupled with an isolated top-side thermal pad. The high design

flexibility of the package enables several configurations, including phase legs, boost,

and single switch through different combinations of the internal power switches.