Features

• Integrated impedance matching to STM32WB5x and STM32WB1x in WLCSP

and UFBGA packages

• 50 Ω nominal impedance on antenna side

• Deep rejection harmonics filter

• Low insertion loss

• Small footprint

• Low profile ≤ 630 μm after reflow

• High RF performances

• RF BOM and area reduction

• ECOPACK2 compliant component

Applications

• Bluetooth 5

• OpenThread

• Zigbee®

• IEEE 802.15.4

• Optimized for STM32WB5x and STM32WB1x in WLCSP and UFBGA

packages

Description

The MLPF-WB-02D3 integrates an impedance matching network and harmonics

filter. The matching impedance network has been tailored to maximize the RF

performances of STM32WB5x and STM32WB1x in WLCSP and UFBGA packages.

This device uses STMicroelectronics IPD technology on non-conductive glass

substrate which optimizes RF performances.