DESCRIPTION

The Bridges series from ST Microelectronics has been designed to allow a better standardization of packages on boards principally designedwith ISOTOP packages. The insulated package of the bridge will be able to sit on heatsink with other components. Single phase and 3-phase high power SMPS, UPS, MOTOR DRIVES and WELDING equipment will primarily find advantage in these industry package products.

FEATURES AND BENEFITS

■ COMPACT ISOTOP DESIGN COMPATIBLE WITH FAST DIODES AND TRANSISTORS.

■ EXCELLENTTHERMAL TRANSFER BETWEEN JUNCTION AND HEATSINK

■ UL PENDING