DESCRIPTION

The AM81720-012 is designed specifically for Telecommunications applications.

The device is capable of withstanding any mismatch load condition at any phase angle (VSWR ∞:1) under full rated conditions. The unit is an overlay, emitter site ballasted, geometry utilizing a refractory/gold metallization system.

The unique AMPAC™ devices are housed in Hermetic Metal/Ceramic packages with internal Input/Output matching structures.

■ REFRACTORY/GOLD METALLIZATION

■ EMITTER SITE BALLASTED

■ RUGGIZED VSWR ∞:1

■ LOW THERMAL RESISTANCE

■ INPUT/OUTPUT MATCHING

■ OVERLAY GEOMETRY

■ METAL/CERAMIC HERMETIC PACKAGE

■ POUT = 12 W MIN. WITH 7.4 dB GAIN