Features

• 3-level topology

• ACEPACK 2 power module

– 13 mΩ of typical RDS(on) each switch

– Insulation voltage UL certified of 2.5 kVrms

– Integrated NTC temperature sensor

– DBC Cu-Al2O3-Cu based

– Press fit contact pins

Description

This ACEPACK 2 power module represents a leg of a T-type 3-level inverter

topology that integrates the advanced silicon carbide Power MOSFET technology

from STMicroelectronics. This module leverages the innovative properties of the

wide-bandgap SiC material and a high-thermal-performance substrate. The result is

exceptionally low on-resistance per unit area and excellent switching performance

that is virtually independent of temperature. An NTC sensor completes the design.

Applications

• DC/DC converter