位置:QFP-SD > QFP-SD详情
QFP-SD中文资料
QFP-SD数据手册规格书PDF详情
DESCRIPTION
STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD. LQFP-SD is a stacked die low profile QFP. LQFP-ep-SD is an exposed pad version that provides enhanced thermal performance. TQFP-ep-SD is a thin profile exposed pad version with enhanced thermal performance. STATS ChipPAC’s chip stacking technology allows the integration of multiple ICs within a single package to improve package performance and functionality while reducing overall package size and cost.
FEATURES
• Combining devices into one package reduces PCB real estate and cost
• Increased sub-system performance by integrating multiple chips into a single package
• Die to die bonding capability for device/signal integration
• Standard and green/lead-free materials and Pb-free plating
• Options for mixed technologies, 2 or more stacked dice
• Fine pitch bonding capability
• Exposed pad provides enhanced thermal performance
• Low profile package thickness of 1.40mm (LQFP-SD and LQFP-ep-SD); 1.00mm (TQFP-ep-SD)
• Lead pitch ranges from 0.80mm to 0.40mm
• Pin count ranges from 32 to 208 leads (LQFP-SD), 64 to 216 leads (LQFP-ep-SD), 32 to 100 leads (TQFP-ep-SD)
• JEDEC standard compliant package outlines
QFP-SD产品属性
- 类型
描述
- 型号
QFP-SD
- 制造商
STATSCHIP
- 制造商全称
STATSCHIP
- 功能描述
Stacked Die Quad Flat Pack
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
FARADAY |
23+ |
NA |
19960 |
只做进口原装,终端工厂免费送样 |
|||
HP |
23+ |
65480 |
|||||
AGILENT |
00+ |
光纤 |
10 |
原装现货海量库存欢迎咨询 |
|||
DELTA |
2024+ |
散热风扇 |
871 |
专营DELTA绝对现货特价 |
|||
DELTA |
22+ |
NA |
500000 |
万三科技,秉承原装,购芯无忧 |
|||
台达 |
23+ |
风机 |
2000 |
优势货源原装正品 |
|||
TI/德州仪器 |
23+ |
TSSOP-14 |
11200 |
原厂授权一级代理、全球订货优势渠道、可提供一站式BO |
|||
TAIYO |
24+ |
6868 |
原装现货,可开13%税票 |
||||
SAMTEC |
24+ |
con |
35960 |
查现货到京北通宇商城 |
|||
Samtec |
24+ |
连接器 |
1267 |
进口原装正品优势供应 |
QFP-SD 资料下载更多...
QFP-SD 芯片相关型号
- BXA75
- CD1005-Z33
- CD1005-Z36
- CD1005-Z39
- CD1005-Z7V5
- CD214B-T14CA
- CD214B-T18CA
- CD214B-T22CA
- CD214C-T24CA
- CD214C-T70CA
- MF-USMF020
- NVFAZ15DC24VBR
- NVFAZ20DC12VBR
- NVFAZ20DC24VBR
- NVFBS20DC12VBD
- NVFBZ15DC24VAD
- RA-08
- RA-09
- RAR-01-K-T
- RAR-06-R-T
- RIR-01-H
- RIR-01-H-T
- RIR-04-S
- RIR-05-S
- RIR-07-S
- RIR-08-S
- RL-1608-S-1500
- RNP20SC101F010
- RSR/RS-06
- RSR-12-K
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STATS ChipPAC, Ltd. 台湾星科金朋半导体股份有限公司
STATS ChipPAC, Ltd. 是一家全球性的半导体封装和测试服务提供商,总部位于新加坡。该公司提供先进的半导体封装和测试解决方案,为全球半导体行业的客户提供服务。STATS ChipPAC 的产品和服务涵盖了多个领域,包括射频 (RF)、高性能的封装技术、无源元件和先进的射频封装解决方案。 STATS ChipPAC 专注于开发和生产高性能、先进技术的封装和测试解决方案,以满足客户对于半导体产品高度集成和性能需求的要求。公司拥有多个先进的制造和测试设施,致力于为客户提供创新、可靠和高质量的产品和服务。 作为半导体封装和测试领域的领导者,STATS ChipPAC 在全球拥有广泛的客户