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S70WS512N00BFWAB3中文资料
| 厂家型号 | S70WS512N00BFWAB3 |
| 文件大小 | 1044.14Kbytes |
| 页面数量 | 93页 |
| 功能描述 | Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory Same-Die Stacked Multi-Chip Product(MCP) 512 Megabit(32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory |
| 数据手册 | |
| 生产厂商 | SPANSION |
S70WS512N00BFWAB3数据手册规格书PDF详情
General Description
The S70WS512N Series is a product line of stacked Multi-Chip Product (MCP) packages and consists of two S29WS-N flash memory die.
Distinctive Characteristics
MCP Features
■ Power supply voltage of 1.7 V to 1.95 V
■ Burst Speed: 54 MHz, 66 MHz
■ Package
— 8 x 11.6 mm
■ Operating Temperature
— Wireless, –25°C to +85°C
S70WS512N00BFWAB3产品属性
- 类型
描述
- 型号
S70WS512N00BFWAB3
- 制造商
SPANSION
- 制造商全称
SPANSION
- 功能描述
Same-Die Stacked Multi-Chip Product(MCP) 512 Megabit(32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
Cypress |
25+ |
电联咨询 |
7800 |
公司现货,提供拆样技术支持 |
|||
GENESIC |
25+ |
DO-5 |
326 |
就找我吧!--邀您体验愉快问购元件! |
|||
24+ |
N/A |
63000 |
一级代理-主营优势-实惠价格-不悔选择 |
||||
GeneSiC Semiconductor |
25+ |
DO-5 |
9350 |
独立分销商 公司只做原装 诚心经营 免费试样正品保证 |
|||
24+ |
3000 |
自己现货 |
|||||
SAMSUNG |
23+ |
CSP30 |
50000 |
全新原装正品现货,支持订货 |
|||
SAMSUNG |
17+ |
CSP30 |
1000 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
SAMSUNG/三星 |
原厂封装 |
9800 |
原装进口公司现货假一赔百 |
||||
23+ |
TO-92 |
11200 |
原厂授权一级代理、全球订货优势渠道、可提供一站式BO |
||||
STRETCH |
21+ |
DNA |
120 |
公司现货,有挂就有货。 |
S70WS512N00BFWAB3 资料下载更多...
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SPANSION相关芯片制造商
Datasheet数据表PDF页码索引
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