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S70GL02GP12FAIR12中文资料
S70GL02GP12FAIR12数据手册规格书PDF详情
General Description
The Spansion S70GL02GP 2-Gigabit Mirrorbit Flash memory device is fabricated on 90 nm process technology. This device offers a fast page access time of 25 ns with a corresponding random access time of 110 ns. It features a Write Buffer that allows a maximum of 32 words/64 bytes to be programmed in one operation, resulting in faster effective programming time than standard single byte/word programming algorithms. This makes the device an ideal product for today’s embedded applications that require higher density, better performance and lower power consumption.
Distinctive Characteristics
■ Two 1024 Megabit (S29GL01GP) in a single 64-ball FortifiedBGA package (see publication S29GL-P_00 for full specifications)
■ Single 3V read/program/erase (3.0V - 3.6V)
■ 90 nm MirrorBit process technology
■ 8-word/16-byte page read buffer
■ 32-word/64-byte write buffer reduces overall programming time for multiple-word writes
■ Secured Silicon Sector region
– 128-word/256-byte sector for permanent, secure identification through an 8-word/16-byte random Electronic Serial Number
– Can be programmed and locked at the factory or by the customer
■ Uniform 64Kword/128KByte Sector Architecture
– S70GL02GP: two thousand forty-eight sectors
■ 100,000 erase cycles per sector typical
■ 20-year data retention typical
■ Offered Packages
– 64-ball Fortified BGA
■ Suspend and Resume commands for Program and Erase operations
■ Write operation status bits indicate program and erase operation completion
■ Unlock Bypass Program command to reduce programming time
■ Support for CFI (Common Flash Interface)
■ Persistent and Password methods of Advanced Sector Protection
■ WP#/ACC input
– Accelerates programming time (when VACC is applied) for greater throughput during system production
– Protects first or last sector of each die, regardless of sector protection settings
■ Hardware reset input (RESET#) resets device
■ Ready/Busy# output (RY/BY#) detects program or erase cycle completion
S70GL02GP12FAIR12产品属性
- 类型
描述
- 型号
S70GL02GP12FAIR12
- 制造商
SPANSION
- 制造商全称
SPANSION
- 功能描述
2 Gigabit, 3.0 Volt-only Page Mode Flash Memory featuring 90 nm MirrorBit Process Technology
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
21+ |
24-TBGA |
5280 |
进口原装!长期供应!绝对优势价格(诚信经营 |
|||
Cypress Semiconductor Corp |
21+ |
64-FBGA(11x13) |
56200 |
一级代理/放心采购 |
|||
CYPRESS |
20+ |
BGA-64 |
1001 |
就找我吧!--邀您体验愉快问购元件! |
|||
英飞凌/赛普拉斯 |
22+ |
NA |
500000 |
万三科技,秉承原装,购芯无忧 |
|||
Cypress |
22+ |
64FBGA (11x13) |
9000 |
原厂渠道,现货配单 |
|||
Cypress Semiconductor Corp |
24+ |
64-LBGA |
9350 |
独立分销商,公司只做原装,诚心经营,免费试样正品保证 |
|||
SPANSIO |
2023+ |
BGA |
700000 |
柒号芯城跟原厂的距离只有0.07公分 |
|||
CypressSemiconductorCorp |
19+ |
68000 |
原装正品价格优势 |
||||
CYPRESS |
23+ |
64-FBGA11x13 |
8000 |
只做原装现货 |
S70GL02GP12FAIR12 资料下载更多...
S70GL02GP12FAIR12 芯片相关型号
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SPANSION 飞索半导体
飞索半导体(Infineon Technologies)是一家总部位于德国的全球领先的半导体制造商。公司提供广泛的半导体解决方案,涵盖多个领域,包括汽车、工业、通信、物联网和安全领域。飞索半导体产品包括功率半导体、芯片卡和安全解决方案、传感器、控制器等,用于驱动各种应用,包括汽车电子系统、工业自动化、物联网设备等。 飞索半导体以其在汽车电子领域的领先地位而闻名,为汽车制造商提供广泛的解决方案,包括汽车电力驱动系统、车载传感器和控制器、汽车安全系统等。此外,公司还专注于提供创新的安全解决方案,用于数据保护、身份验证和网络安全领域。 作为全球领先的半导体公司之一,飞索半导体致力于提供高质量、高性能