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MBM29DL32XTE80中文资料
MBM29DL32XTE80数据手册规格书PDF详情
■ DESCRIPTION
The MBM29DL32XTE/BE are a 32 M-bit, 3.0 V-only Flash memory organized as 4 Mbytes of 8 bits each or 2 Mwords of 16 bits each. These devices are designed to be programmed in-system with the standard system 3.0 V VCC supply. 12.0 V VPP and 5.0 V VCC are not required for write or erase operations. The devices can also be reprogrammed in standard EPROM programmers.
■ FEATURES
• 0.23 µm Process Technology
• Simultaneous Read/Write operations (dual bank)
Multiple devices available with different bank sizes (Refer to “MBM29DL32XTE/BE Device Bank Divisions” in “■ FEATURES”)
Host system can program or erase in one bank, then immediately and simultaneously read from the other bank
Zero latency between read and write operations
Read-while-erase
Read-while-program
• Single 3.0 V read, program, and erase
Minimizes system level power requirements
• Compatible with JEDEC-standard commands
Uses same software commands as E2PROMs
• Compatible with JEDEC-standard world-wide pinouts
48-pin TSOP (1) (Package suffix : TN − Normal Bend Type, TR − Reversed Bend Type)
63-ball FBGA (Package suffix : PBT)
• Minimum 100,000 program/erase cycles
• High performance
80 ns maximum access time
• Sector erase architecture
Eight 4 Kword and sixty-three 32 Kword sectors in word mode
Eight 8 Kbyte and sixty-three 64 Kbyte sectors in byte mode
Any combination of sectors can be concurrently erased. Also supports full chip erase.
• Boot Code Sector Architecture
T = Top sector
B = Bottom sector
• HiddenROM region
64 Kbyte of HiddenROM, accessible through a new “HiddenROM Enable” command sequence
Factory serialized and protected to provide a secure electronic serial number (ESN)
• WP/ACC input pin
At VIL, allows protection of boot sectors, regardless of sector group protection/unprotection status
At VACC, increases program performance
• Embedded EraseTM Algorithms
Automatically pre-programs and erases the chip or any sector
• Embedded ProgramTM Algorithms
Automatically writes and verifies data at specified address
• Data Polling and Toggle Bit feature for detection of program or erase cycle completion
• Ready/Busy output (RY/BY)
Hardware method for detection of program or erase cycle completion
• Automatic sleep mode
When addresses remain stable, automatically switch themselves to low power mode.
• Low VCC write inhibit ≤ 2.5 V
• Erase Suspend/Resume
Suspends the erase operation to allow a read data and/or program in another sector within the same device
• Sector group protection
Hardware method disables any combination of sector groups from program or erase operations
• Sector Group Protection Set function by Extended sector group protection command
• Fast Programming Function by Extended Command
• Temporary sector group unprotection
Temporary sector group unprotection via the RESET pin.
• In accordance with CFI (Common Flash Memory Interface)
MBM29DL32XTE80产品属性
- 类型
描述
- 型号
MBM29DL32XTE80
- 制造商
SPANSION
- 制造商全称
SPANSION
- 功能描述
FLASH MEMORY CMOS 32 M(4 M X 8/2 M X 16) BIT Dual Operation
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
FUJITSU/富士通 |
23+ |
BGA |
89630 |
当天发货全新原装现货 |
|||
FUJITSU/富士通 |
2022+ |
975 |
全新原装 货期两周 |
||||
FUJITSU |
ROHS |
56520 |
一级代理 原装正品假一罚十价格优势长期供货 |
||||
FUJITSU/富士通 |
24+ |
NA |
990000 |
明嘉莱只做原装正品现货 |
|||
FUJITSU/富士通 |
23+ |
TSSOP |
13000 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
|||
FUJITSU |
2025+ |
TSSOP |
3550 |
全新原厂原装产品、公司现货销售 |
|||
FUJITSU/富士通 |
0416+ |
TSSOP |
957 |
原装现货 |
|||
FUJITSU/富士通 |
24+ |
TSSOP |
23000 |
只做正品原装现货 |
|||
FUJITSU/富士通 |
2450+ |
TSSOP |
6540 |
只做原装正品假一赔十为客户做到零风险!! |
|||
FUJITSU |
24+ |
TSOP |
3840 |
MBM29DL32XTE80 资料下载更多...
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SPANSION相关芯片制造商
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