位置:MBM29DL323BE90TN > MBM29DL323BE90TN详情
MBM29DL323BE90TN中文资料
MBM29DL323BE90TN数据手册规格书PDF详情
■ DESCRIPTION
The MBM29DL32XTE/BE are a 32 M-bit, 3.0 V-only Flash memory organized as 4 Mbytes of 8 bits each or 2 Mwords of 16 bits each. These devices are designed to be programmed in-system with the standard system 3.0 V VCC supply. 12.0 V VPP and 5.0 V VCC are not required for write or erase operations. The devices can also be reprogrammed in standard EPROM programmers.
■ FEATURES
• 0.23 µm Process Technology
• Simultaneous Read/Write operations (dual bank)
Multiple devices available with different bank sizes (Refer to “MBM29DL32XTE/BE Device Bank Divisions” in “■ FEATURES”)
Host system can program or erase in one bank, then immediately and simultaneously read from the other bank
Zero latency between read and write operations
Read-while-erase
Read-while-program
• Single 3.0 V read, program, and erase
Minimizes system level power requirements
• Compatible with JEDEC-standard commands
Uses same software commands as E2PROMs
• Compatible with JEDEC-standard world-wide pinouts
48-pin TSOP (1) (Package suffix : TN − Normal Bend Type, TR − Reversed Bend Type)
63-ball FBGA (Package suffix : PBT)
• Minimum 100,000 program/erase cycles
• High performance
80 ns maximum access time
• Sector erase architecture
Eight 4 Kword and sixty-three 32 Kword sectors in word mode
Eight 8 Kbyte and sixty-three 64 Kbyte sectors in byte mode
Any combination of sectors can be concurrently erased. Also supports full chip erase.
• Boot Code Sector Architecture
T = Top sector
B = Bottom sector
• HiddenROM region
64 Kbyte of HiddenROM, accessible through a new “HiddenROM Enable” command sequence
Factory serialized and protected to provide a secure electronic serial number (ESN)
• WP/ACC input pin
At VIL, allows protection of boot sectors, regardless of sector group protection/unprotection status
At VACC, increases program performance
• Embedded EraseTM Algorithms
Automatically pre-programs and erases the chip or any sector
• Embedded ProgramTM Algorithms
Automatically writes and verifies data at specified address
• Data Polling and Toggle Bit feature for detection of program or erase cycle completion
• Ready/Busy output (RY/BY)
Hardware method for detection of program or erase cycle completion
• Automatic sleep mode
When addresses remain stable, automatically switch themselves to low power mode.
• Low VCC write inhibit ≤ 2.5 V
• Erase Suspend/Resume
Suspends the erase operation to allow a read data and/or program in another sector within the same device
• Sector group protection
Hardware method disables any combination of sector groups from program or erase operations
• Sector Group Protection Set function by Extended sector group protection command
• Fast Programming Function by Extended Command
• Temporary sector group unprotection
Temporary sector group unprotection via the RESET pin.
• In accordance with CFI (Common Flash Memory Interface)
MBM29DL323BE90TN产品属性
- 类型
描述
- 型号
MBM29DL323BE90TN
- 制造商
SPANSION
- 制造商全称
SPANSION
- 功能描述
FLASH MEMORY CMOS 32 M(4 M X 8/2 M X 16) BIT Dual Operation
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
FUJ |
25+ |
TSOP48 |
4500 |
百分百原装正品 真实公司现货库存 本公司只做原装 可 |
|||
FUJ |
22+ |
TSOP48 |
5000 |
全新原装现货!价格优惠!可长期 |
|||
FUJITSU/富士通 |
23+ |
TSOP |
13000 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
|||
FUJITSU |
0305+ |
TSOP |
886 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
FUJI |
2025+ |
TSOP48 |
3827 |
全新原厂原装产品、公司现货销售 |
|||
FUJITSU |
23+ |
TSOP |
886 |
全新原装正品现货,支持订货 |
|||
ATTENTION |
25+ |
TSOP |
26200 |
原装现货,诚信经营! |
|||
FUJITSU |
22+ |
TSOP |
20000 |
公司只做原装 品质保障 |
|||
FUJITSU |
0318+ |
TSOP |
878 |
||||
MAGCOM |
23+ |
SOP-16 |
12000 |
全新原装假一赔十 |
MBM29DL323BE90TN 资料下载更多...
MBM29DL323BE90TN 芯片相关型号
- 84B1B-B12-J08L
- 84C2B-B12-J08L
- MBM29DL163TE-70PBT
- MBM29DL163TE-90PBT
- MBM29LV160BM90PBT
- MBM29PL32TM90PBT
- NREHS103M6.3V18X20F
- NREHS472M6.3V18X20F
- NRELX100M1618X25F
- NRLM472M50V22X35F
- NRLMW153M50V22X35F
- NRLMW333M50V22X35F
- NRLMW473M50V22X35F
- NRLMW822M50V22X35F
- NRSG222M6.3V8X15TRF
- NRSG472M6.3V8X15TRF
- NRSH152M35V10X12.5F
- NRSS332M100V12.5X25TRF
- NRSX101M16V8X11.5TRF
- NRSX271M16V8X11.5TRF
- NRSY153M50V10X20TBF
- NRWA102M50V8X11.5TBF
- NRWA332M50V8X11.5TBF
- NRWS153M10V10X12.5F
- NRWS472M10V10X12.5F
- NSR220M25V8X5TBF
- NSR2R2M25V8X5TBF
- NSTLW152M350V64X141F
- NSTLW682M350V64X141F
- XC6101C417
SPANSION相关芯片制造商
Datasheet数据表PDF页码索引
- P1
- P2
- P3
- P4
- P5
- P6
- P7
- P8
- P9
- P10
- P11
- P12
- P13
- P14
- P15
- P16
- P17
- P18
- P19
- P20
- P21
- P22
- P23
- P24
- P25
- P26
- P27
- P28
- P29
- P30
- P31
- P32
- P33
- P34
- P35
- P36
- P37
- P38
- P39
- P40
- P41
- P42
- P43
- P44
- P45
- P46
- P47
- P48
- P49
- P50
- P51
- P52
- P53
- P54
- P55
- P56
- P57
- P58
- P59
- P60
- P61
- P62
- P63
- P64
- P65
- P66
- P67
- P68
- P69
- P70
- P71
- P72
- P73
- P74
- P75
- P76
- P77
- P78
- P79
- P80
- P81
- P82
- P83
- P84
- P85
- P86
- P87
- P88
- P89
- P90
- P91
- P92
- P93
- P94
- P95
- P96
- P97
- P98
- P99
- P100
- P101
- P102
- P103
- P104
- P105
- P106
- P107
- P108
