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AM70PDL127CDH66IS中文资料
AM70PDL127CDH66IS数据手册规格书PDF详情
GENERAL DESCRIPTION (PDL129)
The Am29PDL129H is a 128 Mbit, 3.0 volt-only Page Mode and Simultaneous Read/Write Flash memory device organized as 8 Mwords. The word-wide data (x16) appears on DQ15-DQ0. This device can be programmed in-system or in standard EPROM programmers. A 12.0 V VPP is not required for write or erase operations.
DISTINCTIVE CHARACTERISTICS
MCP Features
■ Consists of Am29PDL127H/Am29PDL129H, 64 Mb pSRAM and two Am29LV640M.
■ Power supply voltage of 2.7 to 3.1 volt
■ High performance (XIP)
— Access time as fast as 65 ns initial / 25 ns page
■ High performance (Data Storage)
— Access time as fast as 110 ns initial / 30 ns page
■ Package
— 93-Ball FBGA
■ Operating Temperature
— –40°C to +85°C
Flash Memory Features (XIP)
AM29PDL127H/AM29PDL129H
ARCHITECTURAL ADVANTAGES
■ 128 Mbit Page Mode device
— Page size of 8 words: Fast page read access from random locations within the page
■ Dual Chip Enable inputs (PDL129 only)
— Two CE# inputs control selection of each half of the memory space
■ Single power supply operation
— Full Voltage range: 2.7 to 3.1 volt read, erase, and program operations for battery-powered applications
■ Simultaneous Read/Write Operation
— Data can be continuously read from one bank while executing erase/program functions in another bank
— Zero latency switching from write to read operations
■ FlexBank Architecture
— 4 separate banks, with up to two simultaneous operations per device
PDL127:
— Bank A: 16 Mbit (4 Kw x 8 and 32 Kw x 31)
— Bank B: 48 Mbit (32 Kw x 96)
— Bank C: 48 Mbit (32 Kw x 96)
— Bank D: 16 Mbit (4 Kw x 8 and 32 Kw x 31)
PDL129:
— Bank 1A: 48 Mbit (32 Kw x 96)
— Bank 1B: 16 Mbit (4 Kw x 8 and 32 Kw x 31)
— Bank 2A: 16 Mbit (4 Kw x 8 and 32 Kw x 31)
— Bank 2B: 48 Mbit (32 Kw x 96)
■ SecSiTM (Secured Silicon) Sector region
— Up to 128 words accessible through a command sequence
— Up to 64 factory-locked words
— Up to 64 customer-lockable words
■ Both top and bottom boot blocks in one device
■ Manufactured on 0.13 µm process technology
■ 20-year data retention at 125°C
■ Minimum 1 million erase cycle guarantee per sector
PERFORMANCE CHARACTERISTICS
■ High Performance
— Page access times as fast as 25 ns
— Random access times as fast as 65 ns
■ Power consumption (typical values at 10 MHz)
— 45 mA active read current
— 25 mA program/erase current
— 1 µA typical standby mode current
SOFTWARE FEATURES
■ Software command-set compatible with JEDEC 42.4 standard
— Backward compatible with Am29F and Am29LV families
■ CFI (Common Flash Interface) complaint
— Provides device-specific information to the system, allowing host software to easily reconfigure for different Flash devices
■ Erase Suspend / Erase Resume
— Suspends an erase operation to allow read or program operations in other sectors of same bank
■ Unlock Bypass Program command
— Reduces overall programming time when issuing multiple program command sequences
HARDWARE FEATURES
■ Ready/Busy# pin (RY/BY#)
— Provides a hardware method of detecting program or erase cycle completion
■ Hardware reset pin (RESET#)
— Hardware method to reset the device to reading array data
■ WP#/ACC (Write Protect/Acceleration) input
— At VIL, hardware level protection for the first and last two 4K word sectors.
AM70PDL127CDH66IS产品属性
- 类型
描述
- 型号
AM70PDL127CDH66IS
- 制造商
SPANSION
- 制造商全称
SPANSION
- 功能描述
Stacked Multi-Chip Package(MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM(XIP)
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
AMD |
2022+ |
770 |
全新原装 货期两周 |
||||
AMD |
23+ |
NA |
8000 |
只做原装现货 |
|||
AMD |
23+ |
NA |
7000 |
||||
24+ |
N/A |
58000 |
一级代理-主营优势-实惠价格-不悔选择 |
||||
AMD |
23+ |
BGA |
3000 |
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、 |
|||
AMD |
24+ |
BGA |
22055 |
郑重承诺只做原装进口现货 |
|||
ANALOGPOWER |
2022+ |
DFN33 |
50000 |
原厂代理 终端免费提供样品 |
|||
AP/美商亚柏 |
24+ |
NA/ |
5750 |
原装现货,当天可交货,原型号开票 |
|||
AP/美商亚柏 |
24+ |
DFN-83.3x3.3 |
60000 |
全新原装现货 |
|||
NK/南科功率 |
2025+ |
DFN3333-8 |
986966 |
国产 |
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SPANSION相关芯片制造商
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