Features

● Glass passivated chip junction in P600 Package

● Low leakage

● Uni and Bidirectional unit

● Excellent clamping capability

● 30000W Peak power capability at 10 × 1000µs waveform Repetition rate (duty cycle):0.01

● Fast response time: typically less than 1.0ps from 0 Volts to VBR min

● Typical IR less than 5μA above 12V.

● High Temperature soldering: 260°C/40 seconds at terminals

● Typical maximum temperature coefficient ΔVBR = 0.1 × VBR@25°C× ΔT

● Plastic package has Underwriters Laboratory Flammability 94V-0

● Matte tin lead–free Plated

● Halogen free and RoHS compliant

● Typical failure mode is short from over-specified voltage or current

● Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c

● IEC-61000-4-2 ESD 15kV(Air), 8kV (Contact)

● ESD protection of data lines in accordance with IEC 61000-4-2 (IEC801-2)

● EFT protection of data lines in accordance with IEC 61000-4-4 (IEC801-4)