Features

 150 C TJ operation

 Ultralow forward voltage drop

 High purity, high temperature epoxy encapsulation for

enhanced mechanical strength and moisture resistance

 High frequency operation

 Guard ring for enhanced ruggedness and long term reliability

 Trench MOS Schottky technology

 Terminals finish: 100 Pure Tin

 This is a Pb − Free Device

 All SMC parts are traceable to the wafer lot

 Additional testing can be offered upon request