Features

 Surface mount bridge, small package;

 Ideal for printed circuit boards;

 Glass passivated chip junction;

 High forward current capability up to 8.0A;

 High surge current capability;

 High heat dissipation capability;

 Low profile package;

 Low forward voltage drop;

 Plastic package has Underwrites Laboratory

Flammability Classification 94V-0

 This is a Pb − Free Device

 All SMC parts are traceable to the wafer lot

 Additional testing can be offered upon request