Features

Glass passivated device

Ideal for surface mouted applications

Low reverse leakage

Metallurgically bonded construction

High temperature soldering guaranteed: 260 C/10

seconds,0.375”(9.5mm) lead length, 5 lbs. (2.3kg)

tension

Terminals finish: 100 Pure Tin

This is a Halogen Free Device

All SMC parts are traceable to the wafer lot

Additional testing can be offered upon request