125 ℃ TJ operation(VR<5V)

Unique high power, Half-Pak module

Optimized for OR-ing applications

High purity, high temperature epoxy encapsulation for

enhanced mechanical strength and moisture resistance

Ultra low forward voltage drop

High frequency operation

Guard ring for enhanced ruggedness and long term reliability

Baseplate: Nickel plated; Terminals: Nickel plated

This is a Pb − Free Device

All SMC parts are traceable to the wafer lot

Additional testing can be offered upon request