Features:

• Planar Die Construction

• 410mW Power Dissipation

• General Purpose, Medium Current

• Ideally Suited for Automated Assembly Processes

• This is a Pb − Free Device

• All SMC Parts are Traceable to the Wafer Lot

• Additional testing can be offered upon request

Mechanical Data:

• Case: SOT-23, Molded Plastic

• Terminals: Solder Leads Solderable per MIL-STD-202, Method 208

• Polarity: See Diagram

• Weight: 0.008 grams(approx.)