Features:

• Glass Passivated Die Construction

• Ideally Suited for Automatic Assembly

• Low Forward Overload Drop, High Efficiency

• Surge Overload Rating to 30A Peak

• Low Power Loss

• Super-Fast Recovery Time

• Plastic Case Material has UL Flammability Classification Rating 94V-O

• This is a Pb − Free Device

• All SMC parts are traceable to the wafer lot

• Additional testing can be offered upon request