Features:

• Small foot print, surface moutable

• Low forward voltage drop

• High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance

• High frequency operation

• Guard ring for enhanced ruggedness and long term reliability

• This is a Pb − Free Device

• All SMC parts are traceable to the wafer lot

• Additional testing can be offered upon request

Applications:

• Disk Drives

• Switching power supply

• Converters

• Free-Wheeling diodes

• Reverse battery protection

• Battery Charging