Applications

 Receive and Transmit WCDMA FDD and TDD Band 7 systems

 Mode switching for cellular, tablet, and embedded modules

Features

 400 micron WLCSP suitable for direct board attachment

 Low insertion loss optimized for high TDD band applications and

FDD Band 7 applications

 No external DC blocking capacitors required

 Four GPIO control lines with VDD voltage regulator:

 VCTL = 1.8 V

 VDD = 2.45 to 3.00 V

 Small, 15-bump WLCSP, 200 μm diameter, 400 μm pitch

(1.942 x 1.142 x 0.420 mm maximum) package (MSL1, 260 °C

per JEDEC J-STD-020)

Description

The SKY13477-001A is a three-pole, four-throw (3P4T) switch.

Switching is controlled by an integrated GPIO interface with four

control pins. Depending on the logic voltage level applied to the

control pins, the following switched outputs are possible:

 RF1 port can be connected to the RF6 or RF5 port.

 RF2 port can be connected to the RF7 port.

 RF3 port can be connected to the RF4, RF5, RF6, or RF7 port.

No external DC blocking capacitors are required as long as no DC

voltage is applied on any RF path. The internal voltage regulator

allows the VDD supply value to be within 2.45 V to 3.00 V. Logic

control is 1.8 V nominal.

The SKY13477-001A is provided in a compact 15-bump,

1.942 x 1.142 x 0.420 mm (maximum) Wafer Level Chip Scale

Package (WLCSP) that meets requirements for board-level

assembly. Bump and Under-Bump Metallization (UBM) diameters

are 200 microns.

A functional block diagram is shown in Figure 1. The pin

configuration and package are shown in Figure 2. Signal pin

assignments and functional pin descriptions are provided in

Table 1.