Key Features:

• Optimized for size, cost and performance

• Based on the QCA9377-3 chipset

• 802.11 a/b/g/n/ac Wave 2 MU-MIMO

• Bluetooth 5.0 BR/EDR/LE Smart Ready

• Enhanced Tx Power

• SDIO 3.0 WLAN host interface

• Link Rate upto 433 Mbps

• Supports enterprise security, seamless roaming and CCX

• Fine tuned calibration per module

• FCC/IC/CE/MIC modular certification

• Extended temperature range

• Surface mount, and SDIO card form factor versions