Features*

• Solderless assembling solution with

PressFIT signal pins and screw power

terminals

• IGBT 3 High Speed Trench

Technology

• Silicon Carbide (SiC) Free-wheeling

Schottky diodes : Diode 1 (D1…D4)

• Silicon anti-parallel diodes , Diode 2

(D5…D8)

• VCE(sat) with positive temperature

coefficient

• Low inductance case

• Reliable mechanical design with

injection moulded terminals and

reliable internal connections

• UL recognized file no. E63532

• NTC temperature sensor inside

Typical Applications

• High Frequency Resonant Converter

• Interleaved Active Rectifier

• UPS