• SEMEFAB DESIGNED AND DIFFUSED DIE

• HIGH VOLTAGE

• FAST SWITCHING

• HIGH ENERGY RATING

• MILITARY AND HI–REL VERSIONS AVAILABLE IN METAL AND CERAMIC SURFACE MOUNT PACKAGES

FEATURES

• Multi–base for efficient energy distribution across the chip resulting in significantly improved switching and energy ratings across full temperature range.

• Ion implant and high accuracy masking for tight control of characteristics from batch to batch.

• Triple Guard Rings for improved control of high voltages.