DESCRIPTION

These miniature surface mount MOSFETs utilize a high cell density trench process to provide low RDS(on) and to ensure minimal power loss and heat dissipation. Typical applications are DC-DC converters and power management in portable and battery-powered products such as computers, printers, PCMCIA cards, cellular and cordless telephones.

FEATURES

• Low RDS(on) provides higher efficiency and extends battery life

• Low thermal impedance copper leadframce DPAK saves board space

• Fast switching speed

• High performance trench technology