FEATURES

• Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.

• Low profile surface mounted application in order to optimize board space.

• Low power loss, high efficiency.

• High current capability, low forward voltage drop.

• High surge capability

• Guarding for overvoltage protection

• Ultra high-speed switching

• Silicon epitaxial planar chip, metal silicon junction

• Lead-free parts meet environmental standards of MIL-STD-19500 /228