FEATURES

• Batch process design, excellent power dissipation offers.better reverse leakage current and thermal resistance.

• Low profile surface mounted application.in order to optimize board space.

• Low power loss and low forward voltage drop

• High surge, high current capability, and high efficiency.

• Fast switching for high efficiency.

• Guard-ring for overvoltage protection.

• Ultra high-speed switching

• Silicon epitaxial planar chip, metal silicon junction.