Additional technical data

Ambient temperature max. Ta –55 °C to +90 °C

Recommended continuous operatingcurrent at 23°C 0,7 . In

Climatic category 55/090/21 according to IEC 60068-1

Solderability (Reflow- soldering) 235 °C, 2 sec. (215 °C, 3 sec.) according to IEC 60068-2-58

Soldering heat resistance 260 °C, 10 sec.,

Fuse-link temperature rise ≤ 75 K (UL/CSA) trackwidth: 5 mm

according to IEC 60068-2-58

mperaturerhöhungen am Si-Einsatz ≤ 75 K (UL/CSA) according to IEC 60127-4

Storage temperature max. 40 °C at 70 r. H. / r. F.

Materials Housing Glass epoxy, flammability class UL94V-0 inals / Cu / Sn

Net weight pieces 0,12 g