FEATURES

Power pack

Metal silicon junction ,majority carrier conduction

Guard ring for overvoltage protection

Low power loss ,high efficiency

High current capability ,low forward voltage drop

High forward surge capability

High frequency operation

Meets MSL Level ，1 per J-STD-020,LF MA X pea ko f 260℃（for TO-263 package）

Solder bath temperature 275℃ maximum,10s,per JESD-22 B106（ for TO-220AB

and ITO-220AB package）

Component in accordance to RoHS 2015/863/EU