Features

● For surface mounted applications

● Low-profile package

● Ideal for automated placement

● Available in Unidirectional and Bidirectional

● 200 W peak pulse power capability with a 10/1000 μs

waveform

● Low incremental surge resistance, excellent clamping

capability

● Very fast response time

● High temperature soldering guaranteed: 260 °C/10 s at

terminals

● Meets MSL level 1

● Component in accordance to RoHS