位置：HDTF-6-06-S-RA-HS-100 > HDTF-6-06-S-RA-HS-100详情
HDTF-6-06-S-RA-HS-100中文资料
HDTF-6-06-S-RA-HS-100数据手册规格书PDF详情
• Small form factor and modular design provides significant
space-savings and flexibility
• High-performance system
• Up to 84 differential pairs per linear inch
• 3, 4 and 6-pair designs on 4, 6 and 8 columns
• Integrated power, guidance, keying and side walls available
• 85 Ω and 100 Ω options
• Combine any configuration of modules to create one
integrated receptacle (BSP Series); corresponding
terminal modules are individually mounted to the backplane.
Visit samtec.com?BSP or contact HSBP@samtec.com
• Press-fit extraction and insertion tool options; please visit
samtec.com/tooling for details
FEATURES & BENEFITS
HDTF-6-06-S-RA-HS-100 资料下载更多...
HDTF-6-06-S-RA-HS-100 芯片相关型号
- 3KP78A
- 3KP78CA
- 4000_V01
- A0805C470JCT
- A0805C470JNT
- A0805C471JCT
- ECA1CM101B
- ECA1CM101I
- ECA1CM102B
- ECA1CM102I
- HDTF-6-04-S-RA-LC-085
- HDTF-6-04-S-RA-LC-100
- HDTF-6-06-S-RA-HS-085
- HDTF-6-06-S-RA-LC-085
- HDTF-6-06-S-RA-LC-100
- HDTF-6-08-S-RA-HS-085
- HDTF-6-08-S-RA-HS-100
- HDTF-6-08-S-RA-LC-085
- HDTF-6-08-S-RA-LC-100
- KMMLS-1A1B-B
- KMMLS-1A1B-BSLASHQ
- KMMLS-1A1B-C
- KMMLS-1A1B-CSLASHQ
- KMMLS-1A1B-D
- KMMLS-1A1B-DSLASHQ
- KMMLS-1A1B-F
- KMMLS-1A1B-FSLASHQ
- SAT5200
- TL431BQDBZR,215
- TMC2240-BOB
SAMTEC相关芯片制造商
Datasheet数据表PDF页码索引
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