位置:M470T6554CZ0-CLD5 > M470T6554CZ0-CLD5详情
M470T6554CZ0-CLD5中文资料
M470T6554CZ0-CLD5数据手册规格书PDF详情
Features
• Performance range
• JEDEC standard 1.8V ± 0.1V Power Supply
• VDDQ = 1.8V ± 0.1V
• 200 MHz fCK for 400Mb/sec/pin, 267MHz fCK for 533Mb/sec/pin, 333MHz fCK for 667Mb/sec/pin, 400MHz fCK for 800Mb/sec/pin
• 4 Banks
• Posted CAS
• Programmable CAS Latency: 3, 4, 5
• Programmable Additive Latency: 0, 1 , 2 , 3 and 4
• Write Latency(WL) = Read Latency(RL) -1
• Burst Length: 4 , 8(Interleave/nibble sequential)
• Programmable Sequential / Interleave Burst Mode
• Bi-directional Differential Data-Strobe (Single-ended data-strobe is an optional feature)
• Off-Chip Driver(OCD) Impedance Adjustment
• On Die Termination with selectable values(50/75/150 ohms or disable)
• PASR(Partial Array Self Refresh)
• Average Refresh Period 7.8us at lower than a TCASE 85°C, 3.9us at 85°C < TCASE < 95 °C
- support High Temperature Self-Refresh rate enable feature
• Package: 60ball FBGA - 64Mx8 , 84ball FBGA - 32Mx16
• All of Lead-free products are compliant for RoHS
M470T6554CZ0-CLD5产品属性
- 类型
描述
- 型号
M470T6554CZ0-CLD5
- 制造商
SAMSUNG
- 制造商全称
Samsung semiconductor
- 功能描述
DDR2 Unbuffered SODIMM 200pin Unbuffered SODIMM based on 512Mb C-die 64bit Non-ECC
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
Samsung |
21+ |
标准封装 |
5000 |
进口原装,订货渠道! |
|||
SAMSUNG |
20+ |
BGA |
2939 |
||||
SAMSUNG(三星半导体) |
23+ |
FBGA |
23870 |
军用单位指定合供方/只做原装,正品现货 |
|||
SAMSUNG/三星 |
23+ |
NA |
3000 |
只做原装正品价格和数量以咨询为准 |
|||
SAMSUNG/三星 |
23+ |
TSOP |
7935 |
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、 |
|||
SAMSUNG(三星) |
25+ |
封装 |
500000 |
源自原厂成本,高价回收工厂呆滞 |
|||
SAMSUNG(三星) |
25+ |
N/A |
20948 |
样件支持,可原厂排单订货! |
|||
SAMSUNG(三星) |
25+ |
N/A |
21000 |
正规渠道,免费送样。支持账期,BOM一站式配齐 |
|||
SAMSUNG(三星) |
23+ |
NA |
20094 |
正纳10年以上分销经验原装进口正品做服务做口碑有支持 |
|||
SAMSUNG/三星 |
23+ |
BGA |
50000 |
全新原装正品现货,支持订货 |
M470T6554CZ0-CLD5 资料下载更多...
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