位置:K7P403622B-HC25 > K7P403622B-HC25详情
K7P403622B-HC25中文资料
K7P403622B-HC25数据手册规格书PDF详情
FUNCTION DESCRIPTION
The K7P403622B and K7P401822B are 4,718,592 bit Synchronous Pipeline Mode SRAM devices. They are organized as 131,072 words by 36 bits for K7P403622B and 262,144 words by 18 bits for K7P401822B, fabricated using Samsungs advanced CMOS technology.
FEATURES
• 128Kx36 or 256Kx18 Organizations.
• 3.3V VDD, 2.5/3.3V VDDQ.
• LVTTL Input and Output Levels.
• Differential, PECL clock / Single ended or differential LVTTL clock Inputs
• Synchronous Read and Write Operation.
• Registered Input and Registered Output.
• Internal Pipeline Latches to Support Late Write.
• Byte Write Capability(four byte write selects, one for each 9bits)
• Synchronous or Asynchronous Output Enable.
• Power Down Mode via ZZ Signal.
• JTAG Boundary Scan (subset of IEEE std. 1149.1).
• 119(7x17)Pin Ball Grid Array Package(14mmx22mm).
K7P403622B-HC25产品属性
- 类型
描述
- 型号
K7P403622B-HC25
- 制造商
SAMSUNG
- 制造商全称
Samsung semiconductor
- 功能描述
128Kx36 & 256Kx18 Synchronous Pipelined SRAM
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
SAMSUNG |
25+23+ |
BGA |
24536 |
绝对原装正品全新进口深圳现货 |
|||
SAMSUNG |
0722+ |
BGA |
219 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
SAMSUNG |
23+ |
BGA |
8000 |
只做原装现货 |
|||
SAMSUNG |
24+ |
BGA |
5825 |
公司原厂原装现货假一罚十!特价出售!强势库存! |
|||
SAMSUNG |
24+ |
BGA |
20000 |
低价现货抛售(美国 香港 新加坡) |
|||
SAMSUNG |
23+ |
BGA |
65480 |
||||
SAMSUNG |
25+ |
BGA |
1250 |
大量现货库存,提供一站式服务! |
|||
SAMSUNG |
16+ |
BGA |
2500 |
进口原装现货/价格优势! |
|||
SAMSUNG |
BGA |
321 |
正品原装--自家现货-实单可谈 |
||||
SAMSUNG |
24+ |
BGA |
5000 |
只做原装公司现货 |
K7P403622B-HC25 资料下载更多...
K7P403622B-HC25 芯片相关型号
- K4S561632D-TC/L75
- K7P401822B-HC16
- K7P403622M
- K9K2G16Q0M-P
- KM6164002
- KM684002-17
- KM736FV4021
- MI-PC21J-MW
- MI-PC22V-IW
- MI-PC2XJ-MW
- MI-PC64L-MW
- MI-PC6XJ-MW
- R3131N44HA
- RH5RH283B-T2
- RH5RH703B-T2
- RH5RH723B-T2
- RH5RL32AA-T1
- RH5RL34AA-T1
- RN5RL29AA
- RN5RL31AA-T1
- RN5RL32AA-T1
- RN5RZ25LA-TR
- RN5VS09CA
- RQ5RW28BA
- SA2531F
- SA2532CS
- VI-20WIV
- VI-23RIU
- VI-23TIU
- VI-JWXIM
SAMSUNG相关芯片制造商
Datasheet数据表PDF页码索引
- P1
- P2
- P3
- P4
- P5
- P6
- P7
- P8
- P9
- P10
- P11
- P12
- P13
- P14
- P15
- P16
- P17
- P18
- P19
- P20
- P21
- P22
- P23
- P24
- P25
- P26
- P27
- P28
- P29
- P30
- P31
- P32
- P33
- P34
- P35
- P36
- P37
- P38
- P39
- P40
- P41
- P42
- P43
- P44
- P45
- P46
- P47
- P48
- P49
- P50
- P51
- P52
- P53
- P54
- P55
- P56
- P57
- P58
- P59
- P60
- P61
- P62
- P63
- P64
- P65
- P66
- P67
- P68
- P69
- P70
- P71
- P72
- P73
- P74
- P75
- P76
- P77
- P78
- P79
- P80
- P81
- P82
- P83
- P84
- P85
- P86
- P87
- P88
- P89
- P90
- P91
- P92
- P93
- P94
- P95
- P96
- P97
- P98
- P99
- P100
- P101
- P102
- P103
- P104
- P105
- P106
- P107
- P108
