位置:K4B4G0446B-MCF7 > K4B4G0446B-MCF7详情
K4B4G0446B-MCF7中文资料
K4B4G0446B-MCF7数据手册规格书PDF详情
Key Features
• JEDEC standard 1.5V ± 0.075V Power Supply
• VDDQ = 1.5V ± 0.075V
• 400 MHz fCK for 800Mb/sec/pin, 533MHz fCK for 1066Mb/sec/pin,
667MHz fCK for 1333Mb/sec/pin
• 8 Banks
• Posted CAS
• Programmable CAS Latency(posted CAS): 6, 7, 8, 9, 10
• Programmable Additive Latency: 0, CL-2 or CL-1 clock
• Programmable CAS Write Latency (CWL) = 5 (DDR3-800), 6
(DDR3-1066) and 7 (DDR3-1333)
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with starting
address “000” only), 4 with tCCD = 4 which does not allow seamless
read or write [either On the fly using A12 or MRS]
• Bi-directional Differential Data-Strobe
• Internal(self) calibration : Internal self calibration through ZQ pin
(RZQ : 240 ohm ± 1)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at
85°C < TCASE < 95 °C
• Asynchronous Reset
• Package : 78 balls FBGA - x4/x8
• All of Lead-Free products are compliant for RoHS
• All of products are Halogen-free
K4B4G0446B-MCF7产品属性
- 类型
描述
- 型号
K4B4G0446B-MCF7
- 制造商
SAMSUNG
- 制造商全称
Samsung semiconductor
- 功能描述
DDP 4Gb B-die DDR3 SDRAM Specification
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
SAMSUNG |
24+ |
BGA |
20000 |
低价现货抛售(美国 香港 新加坡) |
|||
SAMSUNG |
23+ |
FBGA |
8000 |
只做原装现货 |
|||
SAMSUNG |
23+ |
FBGA |
7000 |
||||
SAMSUNG |
2016+ |
FBGA |
2000 |
只做原装,假一罚十,公司优势内存型号! |
|||
SAMSUNG |
25+23+ |
BGA |
32783 |
绝对原装正品全新进口深圳现货 |
|||
SAMSUNG |
12+ |
BGA |
254 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
SAMSUNG |
BGA |
9500 |
一级代理 原装正品假一罚十价格优势长期供货 |
||||
SAMSUNG/三星 |
24+ |
BGA |
8600 |
正品原装,正规渠道,免费送样。支持账期,BOM一站式配齐 |
|||
SAMSUNG/三星 |
24+ |
BGA |
54000 |
郑重承诺只做原装进口现货 |
|||
SAMSUNG/三星 |
原厂封装 |
9800 |
原装进口公司现货假一赔百 |
K4B4G0446B-MCF7 资料下载更多...
K4B4G0446B-MCF7 芯片相关型号
- 171-002-1S-6C3.250-P1
- 171-007-100P4HN-06
- 171-007-69P4HN-06
- 230-017Z124-6PZ
- 230-019FT16-6PY
- 233-104-00AL23-35SA-01
- 240-034-1-21SCA
- 240-034-33-15SCA
- 311AS034XM1903
- 319F064XN16R
- 377HW041XB21KT
- 500-016NF37BN4-06
- 500-017E69MBN4-06
- 500-017J67MBN4-06
- 500-017NF67MBN4-06
- 500-017Z267MBN4-06
- 500T012J51B
- 507-059B02GL
- 507-178M2104BB
- 507T088XM09B04_09
- 507T088XM09B04SK
- 570S190C09B
- CY7C1413KV18-250BZC
- CY7C1415KV18-300BZI
- CY7C1415KV18-300BZXI
- CY7C1418KV18-250BZI
- CY7C1420KV18-250BZI
- CY7C1420KV18-250BZXI
- CY8C34_11
- K4B1G0446D-HCH9
SAMSUNG相关芯片制造商
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