2.3 V memory module temperature sensor with a 2 Kb SPD EEPROM

Description The STTS2002 is targeted for DIMM modules in mobile personal computing platforms (laptops), servers and other industrial applications. The thermal sensor (TS) in the STTS2002 is compliant with the JEDEC specification TSE2002a2, which defines memory module thermal sensors requirements

2.3 V memory module temperature sensor with a 2 Kb SPD EEPROM

The STTS2002 is targeted for DIMM modules in mobile personal computing platforms (laptops), servers and other industrial applications. The thermal sensor (TS) in the STTS2002 is compliant with the JEDEC specification TSE2002a2, which defines memory module thermal sensors requirements for mobile plat 2.3 V memory module temperature sensor with integrated 2 Kb SPD EEPROM\nForward compatible with JEDEC TSE 2002a2 and backward compatible with STTS424E02\nOperating temperature range:–40 °C to +125 °C\n\nSingle supply voltage: 2.3 V to 3.6 V\n2 mm x 3 mm TDFN8, height: 0.80 mm (max)JEDEC MO-229, WCED;

2.3 V memory module temperature sensor with a 2 Kb SPD EEPROM

文件：770.06 Kbytes Page：52 Pages

2.3 V memory module temperature sensor with a 2 Kb SPD EEPROM

Description The STTS2002 is targeted for DIMM modules in mobile personal computing platforms (laptops), servers and other industrial applications. The thermal sensor (TS) in the STTS2002 is compliant with the JEDEC specification TSE2002a2, which defines memory module thermal sensors requirements

2.3 V memory module temperature sensor with a 2 Kb SPD EEPROM

Description The STTS2002 is targeted for DIMM modules in mobile personal computing platforms (laptops), servers and other industrial applications. The thermal sensor (TS) in the STTS2002 is compliant with the JEDEC specification TSE2002a2, which defines memory module thermal sensors requirements

2.3 V memory module temperature sensor with a 2 Kb SPD EEPROM

文件：770.06 Kbytes Page：52 Pages

2.3 V memory module temperature sensor with a 2 Kb SPD EEPROM

文件：770.06 Kbytes Page：52 Pages

封装/外壳：8-WFDFN 裸露焊盘 功能：温度监视系统（传感器） 包装：管件 描述：IC MEMORY MOD TEMP SENSOR 8TDFN 集成电路（IC） 热管理

256KB and 512KB BurstRAM Secondary Cache Module for PowerPC - Based Systems

The MPC2002SG and MPC2003SG are designed to provide a burstable, high performance,256K/512K L2 cache for the PowerPC 60x processors. The modules are configured as 32K x 72 and 64K x72 bits in a 136 pin dual read out single inline memory module (DIMM). The module uses four of Motorola’s MCM67M518 o

900 MHz TX-MIXER SILICON MONOLITHIC INTEGRATED CIRCUIT

The MRFIC2002 is a double-balanced, active mixer designed for transmitters operating in the 800 MHz to 1.0 GHz frequency range. The design utilizes Motorola’s advanced MOSAIC 3 silicon bipolar RF process to yield superior performance in a cost effective monolithic device. Applications for the MRFI

8 Watt Audio Power Amplifier

文件：131.86 Kbytes Page：4 Pages

8 Watt Audio Power Amplifier

文件：131.86 Kbytes Page：4 Pages

8 Watt Audio Power Amplifier

文件：131.86 Kbytes Page：4 Pages