型号 功能描述 生产厂家&企业 LOGO 操作

PGA ZIF Test & Burn-in Socket for Any Footprint on Std 8x8 to 21x21 Grid

FEATURES • Strong Metal Cam Activates Normally-closed Contacts, Preventing Dependency on Plastic for Contact Force • Handle mounted on Right- or Left-hand Side • Any Footprint Accepted on Standard 13x13 to 21x21 Grid GENERAL SPECIFICATIONS • SOCKET BODY: black UL 94V-0 Polyphenylene Sulfid

ARIES

Aries Electronics,inc

ARIES

32-bit ARM7TDMI RISC static CMOS CPU core

OVERVIEW The HMS30C7202 is a highly integrated low power microprocessor for personal digital assistants, and other applications described below. The device incorporates an ARM720T CPU and system interface logic to interface with various types of devices. HMS30C7202 is a highly modular design base

HynixHynix Semiconductor

海力士海力士半导体

Hynix

MAGNETIC-LATCHING DPDT HALF-SIZE CRYSTAL CAN MILITARY RELAY

文件:1.11117 Mbytes Page:3 Pages

TELEDYNETeledyne Technologies Incorporated

华特力科

TELEDYNE

3M??Scotch짰 Printable Flatback Paper Tape 256

文件:564.56 Kbytes Page:5 Pages

3M

3M Electronics

3M

256b/257b Transcoding for 100 Gb/s Backplane and Copper Cable

文件:343.53 Kbytes Page:21 Pages

IBM

ibm

IBM

STI-ATAFL256产品属性

  • 类型

    描述

  • 型号

    STI-ATAFL256

  • 制造商

    STEC Inc

  • 功能描述

    MEM;

更新时间:2025-8-5 13:00:02
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
BGA
2
INTEL/英特尔
24+
BGA
12000
原装正品 有挂就有货
256KX9
1
1
INTEL/英特尔
24+
BGA
10410
只做原装 公司现货库存
24+
DIP16
3629
原装优势!房间现货!欢迎来电!
INTEL/英特尔
23+
BGA79
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
INTEL
2023+
BGA
50000
原装现货
INTEL
23+
BGA79
5000
专注配单,只做原装进口现货
INTEL/英特尔
2447
BGA
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
INTEL
25+23+
BGA
36904
绝对原装正品全新进口深圳现货

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