型号 功能描述 生产厂家&企业 LOGO 操作
STGB30H65DFB2

Trench gate field-stop, 650 V, 30 A, high-speed HB2 series IGBT in a D²PAK package

Features • Maximum junction temperature : TJ = 175 °C • Low VCE(sat) = 1.65 V (typ.) @ IC = 30 A • Very fast and soft recovery co-packaged diode • Minimized tail current • Tight parameter distribution • Low thermal resistance • Positive VCE(sat) temperature coefficient Applications • We

STMICROELECTRONICS

意法半导体

Trench gate field-stop, 650 V, 30 A, high-speed HB2 series IGBT in a TO-247 long leads package

Features • Maximum junction temperature : TJ = 175 °C • Low VCE(sat) = 1.65 V (typ.) @ IC = 30 A • Very fast and soft recovery co-packaged diode • Minimized tail current • Tight parameter distribution • Low thermal resistance • Positive VCE(sat) temperature coefficient Applications • We

STMICROELECTRONICS

意法半导体

更新时间:2025-8-19 9:12:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
ST/意法半导体
25+
原厂封装
9999
ST/意法
2020+
TO-263
880000
明嘉莱只做原装正品现货
ST
23+
D2PAK
16900
正规渠道,只有原装!
ST
23+
D2PAK
12500
ST系列在售,可接长单
ST
23+
TO-263
50000
全新原装正品现货,支持订货
ST
22+
TO-263
12606
只做原装
ST
24+
D2PAK
200000
原装进口正口,支持样品
ST/意法半导体
25+
原厂封装
10280
ST
2405+
原厂封装
50000
15年芯片行业经验/只供原装正品:0755-83268824邹小姐
ST/意法
2023+
TO-263
1000
专注全新正品,优势现货供应

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