Rockchip ARM Cortex-A17 RK3288 3.5 SBC

Features ƒ Rockchip ARM Cortex-A17 RK3288 Quad Core 1.6GHz ƒ Onboard 2GB DDR3L memory and 8GB eMMC ƒ HDMI 3840x2160 at 60Hz, VGA 1920x1200 at 60Hz, Dual Channel 18/24/30 bit LVDS ƒ Support 4K H.264/H.265 Video decoder ƒ 6 UART, 6 USB2.0, 1 GbE, 8 GPIO, 1 SPI ƒ M.2 for WIFI/BT support, mini-

MediaTek Genio 1200 Cortex A78 & A55 2.5 SBC with UIO40-Express

Features ƒ MediaTek Genio 1200 4 cores A78 & 4 cores A55 ƒ Onboard LPDDR4 8GB, 4000MT/s memory ƒ HDMI 4k60fps, 1 x Dual Channel 24 bit LVDS ƒ 1 x 4-wire RS-232/422/485, 2 x USB3.2 Gen1 By 1, 2 x USB2.0, 1 x Micro SD, 1 x Mic. in / Line out ƒ 1 x M.2 3052 Key B for 5G, 1 x M.2 2230 Key E Slot

NXP i.MX8M Plus Cortex®-A53 2.5 SBC with UIO40-Express

Features ƒ NXP Arm® Cortex®-A53 i.MX8M Plus Quad/Dual up to 1.8 GHz ƒ Onboard LPDDR4 4 GB/ 6 GB, 4000MT/s memory ƒ HDMI 1920x1080 at 60Hz, 1 Single or 1 Dual Channel 24 bit LVDS (or 1 4-Lane MIPI-DSI by BOM Option) ƒ 1 4-wire RS-232/422/485, 1 USB3.2 Gen1 By 1, 1 USB2.0, 1 Micro SD, 1 Mic. i

NXP i.MX8M Mini Cortex®-A53 SMARC 2.0/2.1 Computer-on-Module

Features ƒ NXP i.MX 8M Mini processor with up to 4 Arm Cortex A53 cores ƒ 1 x Arm Cortex-M4 cores ƒ Onboard LPDDR4 memory and eMMC ƒ 1 x 4 lane MIPI-CSI,1 x Dual channel LVDS or 1 x Display Port ƒ 4 x USB2.0, 1 x USB 2.0 OTG, 4 x UART, 4 x I2C, 12 x GPIO, 1 x PCIe2.0, 1x Gigabit LAN ƒ Suppo

Rockchip RK3399 Cortex®-A72A53 SMARC 2.1 Computer-on-Module

Features ƒ Rockchip RK3399 Arm dual Cortex-A72 and quad Cortex-A53 1.8 GHz ƒ Onboard 2/4GB LPDDR4 memory and 16/32GB eMMC ƒ Support HDMI2.0 4K, 1 x eDP, 1 x LVDS ƒ Support 4K H.264/H.265 Video decoder ƒ 2 x USB3.0, 3 x USB2.0,1 x USB2,0 OTG, 3 x UART, 12 x GPIO ƒ 1 x PCIe2.0, 1 x SATA, 2 x M

NXP i.MX8M Cortex®-A53 SMARC 2.0/2.1 Computer-on-Module

Features ƒ NXP i.MX 8M processor with dual or quad Arm Cortex A53 cores ƒ 1 x Arm Cortex-M4 core ƒ Onboard 2GB LPDDR4 memory and eMMC 16GB ƒ 1 x HDMI2.0 up to 4096 x 2160, 1 x 4-Lane MIPI DSI ƒ 2 x USB3.0, 4 x USB2.0, 4 x UART, 4 x I2C, 12 x GPIO, 1 x PCIe2.0, 1 x 4-lane MIPI CSI camera inpu

NXP ARM® Cortex®-A9 i.MX6 Dual/Quad Mini-ITX Motherboard

Features ƒ NXP ARM® Cortex®-A9 i.MX6 Dual/Quad 1GHz high performance processor ƒ On board DDR3 1066MHz 1GB/2GB memory and 8GB EMMC NAND flash ƒ Supports Triple Display: VGA/HDMI/LVDS ƒ Supports 1 x PCIe, 1 x mini-PCIe, 5 x serial ports, 6 x USB, 1 x M.2 socket, 18 x GPIO, 1 x CAN ƒ Low power

Intel® Atom™ E3900 / Pentium® / Celeron® N Series SMARC Module

Features ƒ SMARC2.0 & SMARC2.1 Compliance ƒ Intel® Atom™ E3900 / Pentium® / Celeron® N Series Processors ƒ Integrated dual GbE. wireless module on board design ƒ Dual channel LPDDR4 2/4/8 GB memory down & onboard eMMC ƒ Triple display (DP++, HDMI, LVDS) ƒ Supports iManager, WISE-PaaS/DeviceO

11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Compact Type6

Features ƒ 11th Gen. Intel® Core™ Processor U-Series ƒ COM Express R3.0 Compact Module Type 6 Pinout ƒ Dual channel with one memory down and one SO-DIMM ƒ High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ƒ Onboard NVMe x4 SSD up to 64GB, TPM2.0 (Optional) ƒ Supports SUSI, Device

Intel® Pentium®/Celeron® and Atom® x6000 Series Processors (Code Name: Elkhart Lake) COM Express® Compact Type6

Features ƒ COM Express® R3.0 Compact Module Type 6 Pinout ƒ Intel® Pentium®/Celeron® and Atom® x6000 Series (Elkhart Lake) Processors ƒ Dual Channel up to 32GB DDR4-3200 and IBECC Supported by Specific SKUs ƒ Supports up to 3 simultaneous display: LVDS/eDP, HDMI/DisplayPort ƒ Supports onboar

8th Gen. Intel® Core Processor SoC Multiple I/Os Fanless Embedded System

Features ƒ 8th Gen. Intel Core i7-8665UE/i5-8365UE Quad Core ƒ Dual Display HDMI + DP, up to 4K2K ƒ 4 x GbE, 8 x USB3.0/2.0, 4 x UART, 2 x CANBus ƒ 4 Expansion: M.2 E-Key 2230, M-Key 2280, B-Key 3042, F/S mPCIe ƒ DC-in 12V, Wall Mount & DIN Rail ƒ iManager3.0 & SW APIs, WISE-PaaS/DeviceOn

NXP i.MX 8X Cortex®-A35 RTX v2.1 module

Features ƒ NXP i.MX 8X processor with 2-4 x Arm Cortex-A35 cores ƒ Onbard LPDDR4 memory and eMMC 16GB ƒ Supports wide range power input 5V~24V ƒ Supports Vivante GC7000 Lite hardware accelerators ƒ Supports Ultra HD 4K/ full HD 1080p video decode and HD 1080p video encode hardware engine ƒ

NXP i.MX8M Plus Cortex®-A53 Edge AI RISC-based Box Computer

Features ƒ NXP i.MX8M Plus Cortex®-A53 Quad Core 1.6GHz ƒ On-board LPDDR4 6 GB, 4000MT/s memory ƒ HDMI up to 3840 x 2160 at 30Hz resolution ƒ Dual GbE LAN, 1 USB2.0 and 1 USB3.2 Gen 1 ƒ 1 Micro SD Socket & 1 Nano SIM Slot ƒ 1 mini-PCIe for 3G/4G, 1 M.2 2230 Key E Slot ƒ Yocto Linux and Andr

NXP ARM® Cortex®-A9 i.MX6 SMARC v1.1 Module

Features ƒ NXP ARM® Cortex® -A9 i.MX6 high performance processor ƒ Onbard DDR3 memory and eMMC 16GB ƒ Parallel RGB, HDMI, single channel 18/24-bit LVDS, 1366 x 768 ƒ 2 x CAN, 4 x UART, 5 x I2C, 12 x GPIO, 1 x PCIe, 1 x camera input and 1 x Gigabit LAN ƒ Supports OpenGL ES 2.0 and OpenVG 1.1

NXP i.MX6 Cortex-A9 RISC Embedded Mini-ITX Box Computer

Features ƒ NXP ARM Cortex-A9 i.MX6 Dual/Quad 1GHz high performance processor ƒ On board DDR3 1066MHz 1GB/2GB memory and 8GB EMMC NAND flash ƒ Supports Dual Display: VGA/HDMI ƒ Supports 1 x mini-PCIe, 4 x serial ports, 6 x USB, 1 x M.2 socket,8 x GPIO, 1 x CAN ƒ Low power consumption, fanless

Intel Atom E3900 series Embedded SBC Fanless Slim System

Features ƒ Intel® Atom™ E3900 series ƒ Onboard 4GB LPDDR4-2400MT/s, 32GB eMMC ƒ Independent display by HDMI ƒ Semi-Industry Fanless slim systen, Din Rail or Wall mount design ƒ Support HDMI x 1 , GbE x 2 USB 3.0 x 2, COM x 2, DIO x 2 ƒ Flexible expansion M.2 E key, F/S miniPCIe ƒ 12V power

9th/8th Gen. Intel Xeon /Core™ Processor, 3.5 SBC w/ MIOe

Features ƒ 9th/8th Gen. Intel® Xeon®/Core™ Processor, up to 6 cores, and TDP 45W/25W ƒ Dual channel DDR4-2400, up to 64GB*, ECC for Xeon SKU ƒ Triple simultaneous displays with 48-bit LVDS+HDMI+DP ƒ USB 3.1 Gen2 (10 Gbps), TPM 2.0 & NVMe/PCIe Gen3x4 SSD ƒ Dual GbE, SATAIII, RS-232/422/485, CA

AMD Embedded Ryzen V2000 COM Express® Compact Type 6

Features ƒ AMD Embedded Ryzen 7nm SoC – V2000 APU ƒ COM Express® R3.0 Compact Module Type 6 Pinout ƒ Dual Channel DDR4 SODIMM, max. 64GB (Both ECC & Non-ECC) ƒ High Speed I/Os: 2 USB 3.2 Gen2, 1 PCIe x8 Gen3, 8 PCIe x1 Gen3, and 2 SATA3.0 ƒ Four Display (DP++, HDMI, VGA, LVDS) ƒ Supports iM

11th Gen. Intel® Core™ i7/i5/i3/Celeron U-Series 3.5 SBC w/ MIOe

Features ƒ 11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 15W/ 28W ƒ Dual Channel DDR4-3200 up to 64GB ƒ 4 simultaneous displays: LVDS/HDMI/DP/USB Type-C, eDP (optional) ƒ 2 GbE, 4 USB3.2, CAN Bus, DC-in 12-24V ƒ Expansion: M.2 E-Key/B-Key/M-Key (supports NVMe), MIOe ƒ Supports i

11th Gen. Intel® Core™ i7/i5/i3/Celeron U-series Pico-ITX SBC

Features ƒ 11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 15W ƒ On-board LPDDR4x-4267 up to 32G with IBECC for Industrial Sku ƒ Dual independent display: eDP/MIPI-DSI, DP up to 8K ƒ 2 GbE, 2 USB 3.2, COM Port, SMBus/I2C ƒ Expansion: M.2 E-Key, M.2 B-Key/M-Key NVMe x2 ƒ Supports i

Intel® Xeon® D-2700 Processor (Ice Lake-D HCC) COM-HPC® Server Size D

Features ƒ COM-HPC® Server Size D Module ƒ Intel® Xeon® D-2700 processors (Ice Lake-D HCC) ƒ Up to 20 Cores, 30MB LLC Cache, 118W TDP ƒ Quad channel DDR4-3200 RDIMM/LRDIMM up to 512GB (Both ECC & Non-ECC) ƒ 32 x PCIe Gen 4, 17 x PCIe Gen 3, 4 x 25GBASE-KR, IPMB ƒ Supports iManager, Embedded

AMD EPYC™ 7003 Processor COM-HPC® Server Size E module with proprietary pinout

Features ƒ COM-HPC® Server Size E module with proprietary pinout ƒ Up to 64C/225W AMD EYPC™ 7003 real server grade CPU with extreme performance ƒ Up to 512GB large memory size with 4x DDR4 long DIMM ƒ 79 PCIe Gen4 lanes (14 more than COM-HPC STD) ƒ Supports iManager, Embedded Software APIs,

TI Sitara™ ARM AM3352 Cortex -A8 1GHz RTX2.0 Module

Features ƒ TI Sitara™ ARM® AM3352 Cortex®-A8 1Ghz high performance processor ƒ On board DDR3 512MB memory / 4GB EMMC ƒ Supports wide range power input 5V~24V ƒ Supports 1 GbE, 1 USB 2.0, 1 USB 2.0 OTG, 2 CANbus, 10 GPIO, 4 UART, 1 I2C, 1 I2S, 1 SPI, 1 SDIO ƒ Operating temperature 0 ~ 60 °C /

NXP ARM® Cortex®-A9 i.MX6 RTX v2.0 module

Features ƒ NXP ARM® Cortex®-A9 i.MX6 high performance processor ƒ Onbard DDR3 memory and eMMC 16GB ƒ Supports wide range power input 5V~24V ƒ Supports OpenGL ES 2.0 and OpenVG 1.1 hardware accelerators ƒ Supports full HD 1080p video decode and HD 1080p video encode hardware engine ƒ Support

11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Compact Type6

Features ƒ 11th Gen. Intel® Core™ Processor U-Series ƒ COM Express R3.0 Compact Module Type 6 Pinout ƒ Dual channel with one memory down and one SO-DIMM ƒ High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ƒ Onboard NVMe x4 SSD up to 64GB, TPM2.0 (Optional) ƒ Supports SUSI, Device

11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Compact Type6

Features ƒ 11th Gen. Intel® Core™ Processor U-Series ƒ COM Express R3.0 Compact Module Type 6 Pinout ƒ Dual channel with one memory down and one SO-DIMM ƒ High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ƒ Onboard NVMe x4 SSD up to 64GB, TPM2.0 (Optional) ƒ Supports SUSI, Device

11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Compact Type6

Features ƒ 11th Gen. Intel® Core™ Processor U-Series ƒ COM Express R3.0 Compact Module Type 6 Pinout ƒ Dual channel with one memory down and one SO-DIMM ƒ High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ƒ Onboard NVMe x4 SSD up to 64GB, TPM2.0 (Optional) ƒ Supports SUSI, Device

11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Compact Type6

Features ƒ 11th Gen. Intel® Core™ Processor U-Series ƒ COM Express R3.0 Compact Module Type 6 Pinout ƒ Dual channel with one memory down and one SO-DIMM ƒ High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ƒ Onboard NVMe x4 SSD up to 64GB, TPM2.0 (Optional) ƒ Supports SUSI, Device

11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Compact Type6

Features ƒ 11th Gen. Intel® Core™ Processor U-Series ƒ COM Express R3.0 Compact Module Type 6 Pinout ƒ Dual channel with one memory down and one SO-DIMM ƒ High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ƒ Onboard NVMe x4 SSD up to 64GB, TPM2.0 (Optional) ƒ Supports SUSI, Device

11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Compact Type6

Features ƒ 11th Gen. Intel® Core™ Processor U-Series ƒ COM Express R3.0 Compact Module Type 6 Pinout ƒ Dual channel with one memory down and one SO-DIMM ƒ High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ƒ Onboard NVMe x4 SSD up to 64GB, TPM2.0 (Optional) ƒ Supports SUSI, Device

11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Compact Type6

Features ƒ 11th Gen. Intel® Core™ Processor U-Series ƒ COM Express R3.0 Compact Module Type 6 Pinout ƒ Dual channel with one memory down and one SO-DIMM ƒ High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ƒ Onboard NVMe x4 SSD up to 64GB, TPM2.0 (Optional) ƒ Supports SUSI, Device

11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Compact Type6

Features ƒ 11th Gen. Intel® Core™ Processor U-Series ƒ COM Express R3.0 Compact Module Type 6 Pinout ƒ Dual channel with one memory down and one SO-DIMM ƒ High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ƒ Onboard NVMe x4 SSD up to 64GB, TPM2.0 (Optional) ƒ Supports SUSI, Device

11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Compact Type6

Features ƒ 11th Gen. Intel® Core™ Processor U-Series ƒ COM Express R3.0 Compact Module Type 6 Pinout ƒ Dual channel with one memory down and one SO-DIMM ƒ High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ƒ Onboard NVMe x4 SSD up to 64GB, TPM2.0 (Optional) ƒ Supports SUSI, Device

11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Compact Type6

Features ƒ 11th Gen. Intel® Core™ Processor U-Series ƒ COM Express R3.0 Compact Module Type 6 Pinout ƒ Dual channel with one memory down and one SO-DIMM ƒ High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ƒ Onboard NVMe x4 SSD up to 64GB, TPM2.0 (Optional) ƒ Supports SUSI, Device

包装：盒 描述：INTEL CORE I5-1145G7E, 4C, 28W, 嵌入式计算机 单板计算机（SBC），模块化计算机（COM）

包装：盒 描述：INTEL CORE I5-1145G7E, 4C, 28W, 嵌入式计算机 单板计算机（SBC），模块化计算机（COM）

Silicon Monolithic Integrated Circuit

●Description The BD6883GUL, and the BH6453GUL motor driver provide 1 Constant-Current Driver Half-bridge, and 1 Constant-Voltage Driver Half-bridge channel. The BD6886GUL, and the BD6369GUL motor driver provide 1 Constant-Voltage Driver H-bridge channel. These lens drivers are offered in an ult

Dual-/Triple-Voltage, Power-Supply Sequencers/Supervisors

General Description The MAX6880–MAX6883 dual-/triple-voltage monitors are designed to sequence power supplies during power-up condition. When all of the voltages exceed their respective thresholds, these devices turn on volt ages to the system sequentially, enhancing n-channel MOSFETs used as swi

Dual Binding Posts with Base (raised base)

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System Lens Driver Series for Mobile Phone Cameras Parallel Interface Type Lens Drivers for Voice Coil Motor

文件：356.22 Kbytes Page：17 Pages

800mA BTL Linear Fan Motor Driver

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