CERAMIC MELF PIN DIODES

DESCRIPTION This new line of ‘MELF’ high power PIN diodes are hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction. The MELF ceramic package has square end terminations which are ideal for surface mount and pick and place operations. The P

Surface Mount PIN Diodes

This line of \"MELF\" high power PIN diodes are hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction. The MELF ceramic package has square end terminations which are ideal for surface mount and pick and place operations. The PIN diode chips ar

封装/外壳：1208（3020 公制） 包装：卷带（TR） 描述：SI PIN HERMETIC MELF 分立半导体产品 二极管 - 射频

封装/外壳：1208（3020 公制） 包装：卷带（TR） 描述：SI PIN HERMETIC MELF 分立半导体产品 二极管 - 射频

P-SERIES LINEAR PHOTODIODE ARRAY IMAGERS

Description In the P-series linear imagers, PerkinElmer has combined the best features of high-sensitivity photodiode array detection and high-speed charge coupled scanning to offer an uncompromising solution to the increasing demands of advanced imaging applications. Features • Extende

SCRs 1-70 AMPS NON-SENSITIVE GATE

Features ● Electrically Isolated Packages ● High Voltage Capability - 30 - 600 Volts ● High Surge Capability - up to 950 Amps ● Glass Passivated Chip

ECONOLINE - DC/DC - CONVERTER

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2 Watt SIP7 Single & Dual Output

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0.25 Watt SIP4 & DIP8 Single Output

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