CERAMIC MELF PIN DIODES

DESCRIPTION This new line of ‘MELF’ high power PIN diodes are hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction. The MELF ceramic package has square end terminations which are ideal for surface mount and pick and place operations. The P

封装/外壳：1208（3020 公制） 包装：卷带（TR） 描述：SI PIN HERMETIC MELF 分立半导体产品 二极管 - 射频

封装/外壳：1208（3020 公制） 包装：卷带（TR） 描述：SI PIN HERMETIC MELF 分立半导体产品 二极管 - 射频

Single-Ended Cordsets

Basic features Approval/Conformity CE cULus EAC WEEE

Inductive Sensors

BES M12EI-PSC40N-S04G-S Basic features Additional features Selective non-ferrous Approval/Conformity CE UKCA cULus WEEE Basic standard IEC 60947-5-2 Target material Selective non-ferrous

5.0-14.0 GHz GaAs MMIC Packaged Driver Amplifier

Circuit Description Mimix Broadband’s 3 stage 5.0 to 14.0 GHz driver amplifier is packaged in surface mount 3x3 QFN package. The device is a self-biased, single supply design with 20 dB gain and 11 dBm P1dB. This MMIC uses Mimix Broadband’s 0.25um optical pHEMT process. Features ■ 20 dB

Optimized for high performance buck converters

文件：668.25 Kbytes Page：15 Pages

PIANO SWITCHES (FULL PITCH)

文件：451.75 Kbytes Page：5 Pages