3.7mm Square Low-profile (Surface Mount Type)

Available in two types - 0.8mm height without stem or 1.5mm height with stem. Soldering Conditions Condition for Reflow Available for Surface Mount Type. 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φCA（K）or CC（T）at sold

3.7mm Square Low-profile (Surface Mount Type)

Available in two types - 0.8mm height without stem or 1.5mm height with stem. Soldering Conditions Condition for Reflow Available for Surface Mount Type. 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φCA（K）or CC（T）at sold

表面贴装式轻触开关

型： Surface mount\n动作力： 2.35N\n操作方向： Top push\n行程： 0.15mm\n产品高度： 0.35mm\n操作寿命(5mA 5V DC)： 50,000 cycles\n初期接触电阻： 100mΩ max.\n尺寸(W×D×H)： 3.7×3.7×0.35\n系列： Sharp feeling type\n使用温度范围： -30℃ to +85℃\n绝对最大额定值： 50mA 12V DC\n最小额定： 10μA 1V DC\n电性能： \n绝缘电阻： 100MΩ min. 100V DC for 1 min.\n耐电压： 100V AC for 1 mi;

3.7mm Square Low-profile (Surface Mount Type)

Available in two types - 0.8mm height without stem or 1.5mm height with stem. Soldering Conditions Condition for Reflow Available for Surface Mount Type. 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φCA（K）or CC（T）at sold

3.7mm Square Low-profile (Surface Mount Type)

文件：721.74 Kbytes Page：3 Pages

SBD Wafer

SBD Wafer

3.7mm Square Low-profile (Surface Mount Type)

文件：721.74 Kbytes Page：3 Pages

3.7mm Square Low-profile (Surface Mount Type)

文件：721.74 Kbytes Page：3 Pages