0.2A SCHOTTKY BARRIER DIODE CHIP SCALE PACKAGE

Description The SDM0230CSP is a 30-volt 0.2A schottky barrier diode that is optimized for low forward voltage drop and low leakage current housed in a compact chip scale package (CSP) that occupies only 0.18mm2 board-space. The low thermal resistance enables designers to meet design challenges of

0.2A SCHOTTKY BARRIER DIODE CHIP SCALE PACKAGE

封装/外壳：3-XFDFN 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：DIODE SCHOTTKY 200MA 3DFN 分立半导体产品 二极管 - 整流器 - 单

SMD Schottky Barrier Diode

Features IO = 200mA VR = 30V - Designed for mounting on small surface. - Extremely thin package. - Low drop-down voltage. - Majority carrier conduction - Lead-free device Mechanical Data - Case :0603(1608) 1005(2512) standard package, molded plastic. - Terminals : Gold plated, sold

SMD Schottky Barrier Diode

Io = 200 mA VR = 30 Volts Features Designed for mounting on small surface. Extremely thin/leadless package. Low drop-down voltage. Majority carrier conduction. Mechanical data Case: 1005 (2512) Standard package , molded plastic. Terminals: Gold plated, solderable per MIL

SMD Schottky Barrier Diode

Io = 200 mA VR = 30 Volts Features Designed for mounting on small surface Extremely thin package Low stored charge Majority carrier conduction Mechanical data Case: 0805(2012) Standard package , molded plastic. Terminals: Solder plated, solderable per MIL-STD-750, method

SMD Schottky Barrier Diode

Io = 200 mA VR = 30 Volts Features Designed for mounting on small surface. Extremely thin/leadless package. Low drop-down voltage. Majority carrier conduction. Mechanical data Case: 0603 (1608) Standard package , molded plastic. Terminals: Gold plated, solderable per MIL

824 to 849 MHz 28.5 dBm, Cellular InGaP HBT Amplifier Module

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