SMD POWER INDUCTOR

MATERIALS： a. Core：Ferrite DR core b. Wire：Enamelled copper wire （class F） c. Base：LCP E4008 d. Terminal：Cu/Ni/Sn e. Adhesive：Epoxy resin f. Solder wire：Sn97/Cu3 Alloys g. Remark：Products comply with RoHS requirements

Standard Thick Film Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer    provides compatibility with lead (Pb)-free and lead    containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified

Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer    provides compatibility with lead (Pb)-free and lead    containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified

Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer    provides compatibility with lead (Pb)-free and lead    containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified

Standard Thick Film Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer    provides compatibility with lead (Pb)-free and lead    containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified

Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer    provides compatibility with lead (Pb)-free and lead    containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified