型号 功能描述 生产厂家 企业 LOGO 操作

4GB , 3.3 V, e.MMC Flash

Features e.MMC 5.1 Specification Compatible – Backward compatible with previous e.MMC specifications Key Supported Features  HS400, HS200  Boot Feature/ Boot Partition  Partitioning, RPMB, RPMB Throughput Improve  HPI, BKOPS, BKOP Operation Control  Sanitize, Discard, Trim, Erase 

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4GB , 3.3 V, e.MMC Flash

Features e.MMC 5.1 Specification Compatible – Backward compatible with previous e.MMC specifications Key Supported Features  HS400, HS200  Boot Feature/ Boot Partition  Partitioning, RPMB, RPMB Throughput Improve  HPI, BKOPS, BKOP Operation Control  Sanitize, Discard, Trim, Erase 

ETCList of Unclassifed Manufacturers

未分类制造商

更新时间:2025-11-1 23:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
NA
24+
NA/
30
优势代理渠道,原装正品,可全系列订货开增值税票
SKYHIGH
23+
BGA153
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
CYPRESS
原厂封装
9800
原装进口公司现货假一赔百
24+
3
CYPRESS
25+
BGA
3111
CYPRESS/赛普拉斯
2450+
BGA
9850
只做原厂原装正品现货或订货假一赔十!
24+
N/A
52000
一级代理-主营优势-实惠价格-不悔选择
NA
23+
TO-247
50000
全新原装正品现货,支持订货
GeneSiC
25+
电联咨询
7800
公司现货,提供拆样技术支持
Shindenge
05+
TO-3P
170
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