Features

1) Area ratio is approximately 55 smaller than that of the MCH18, enabling high - density mounting.

2) Mounting costs are reduced.

3) Use of convex electrodes prevents solder bridging during mounting, and makes it easy to perform a visual inspection of the mounted piece. Also facilitates automatic inspection.

4) Barrier layer and end terminations to improve solderability.

5) Each element is independent to ensure a wide range of circuit applications.

6) Can be packed on tape.