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BA6566F中文资料
BA6566F数据手册规格书PDF详情
The BA6566, BA6566F, and BA6566FP are speech network ICs which possess the basic functions required for handset communications. In addition to amplifying signals from a transmitter and sending them to a telephone line, they amplify only reception signals from a telephone line and drive the receiver. They also compensate for fluctuation in the volume at which signals are transmitted and received, caused by the length of the telephone line (AGC).
Features
1) Can accommodate both dynamic and piezoelectric
receivers, simply by changing the circuit constant for
a wide dynamic reception range.
2) Automatic gain control (AGC) is used, based on the
transmission and reception telephone line current,
for easier compliance with communications standards.
3) Erroneous operation caused by high-frequency electrical
wave interference is minimized.
4) An HSOP package is used, eliminating the need for
an attached transistor to dissipate heat. This means
that a common circuit can be shared when a DIP
package is used (BA6566FP).
Applications
Telephones and telephone equipment
BA6566F产品属性
- 类型
描述
- 型号
BA6566F
- 制造商
ROHM
- 制造商全称
Rohm
- 功能描述
Speech network
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
ROHM |
19+ |
SOP |
15695 |
||||
Rohm Semiconductor |
24+ |
NA |
25000 |
in stock接口IC-原装正品 |
|||
ROHM |
2014+ |
65 |
公司现货库存 |
||||
ROHM |
25+ |
SMD |
20000 |
专做罗姆,一系列可以订货排单,只做原装正品假一罚十 |
|||
ROHM/罗姆 |
20+21+ |
SOP18 |
58550 |
金睿扬电子,只做全新原装正品可订货欢迎咨询QQ微信 |
|||
ROHM/罗姆 |
2021+ |
SOP18 |
9000 |
原装现货,随时欢迎询价 |
|||
ROHM/罗姆 |
23+ |
SOP18 |
15000 |
全新原装现货,价格优势。 |
|||
ROHM |
22+ |
SOP |
8000 |
原装正品支持实单 |
|||
ROHM |
23+ |
SOP18 |
2580 |
现货库存 |
|||
ROHM |
23+ |
SOP18 |
20000 |
全新原装假一赔十 |
BA6566FP-E2 价格
参考价格:¥23.4237
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BA6566F 芯片相关型号
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Rohm 罗姆半导体集团
Rohm Semiconductor(罗姆半导体)是一家总部位于日本的全球知名半导体制造公司,成立于1958年。该公司专注于开发和制造各类半导体产品,包括模拟、数字和混合信号芯片。Rohm的产品广泛应用于消费电子、工业设备、汽车电子及通信设备等多个领域。 作为技术创新的领导者,Rohm不断投资于研发,致力于提高产品的性能和可靠性。公司提供的产品种类繁多,包括功率半导体、集成电路(IC)、传感器、LED驱动器以及电源管理解决方案等。Rohm着重于提供高效能和节能的解决方案,支持可持续发展的目标。 Rohm在全球设有多个生产基地和研发中心,具备强大的制造能力和研发实力,能够满足市场对高品质半导体产