Features

 Maximum target input capacitance: 260pF

 Sampling rates as fast as 0.7ms at 8-bit resolution; 1.6ms at

10-bit; 5.0ms at 12-bit; 18.5ms at 14-bit

 Digital compensation of sensor: piece-wise 1st and 2nd order

sensor compensation or up to 3rd order single-region sensor

compensation

 Digital compensation of 1st and 2nd order temperature gain

and offset drift

 Internal temperature compensation reference (no external

components)

 Programmable capacitance span and offset

 Layout customized for die-die bonding with sensor for lowcost,

high-density chip-on-board assembly

 Accuracy as high as ±0.25 FSO at -40°C to 125°C, 3V, 5V,

Vsupply ±10 (see data sheet section 5 for restrictions)

 Minimized calibration costs: no laser trimming, one-pass

calibration using a digital interface

 Wide capacitance range to support a broad portfolio of

different sensor elements

 Excellent for low-power battery applications

 I2C or SPI interface—easy connection to a microcontroller

 PDM outputs (Filtered Analog Ratiometric) for both

capacitance and temperature

 Up to two alarms that can act as full push-pull or open-drain

switches

 Supply voltage: 2.3V to 5.5V

 Typical current consumption 750μA down to 60μA depending

on configuration

 Typical Sleep Mode current: ≤ 1μA at 85°C

 Operation temperature: –40°C to +125°C depending on part

code

 Die or 4.4  5.0 mm 14-TSSOP package