FEATURES

• Operation freqecncy : fopt1 = 893 to 960 MHz (0.8 GHz Band side)

: fopt2 = 1 429 to 1 453 MHz (1.5 GHz Band side)

• Supply voltage : VDD1, 3 = 2.7 to 2.9 V (2.8 V TYP.)

: VDD2, 4 = 3.2 to 4.23 V (3.5 V TYP.)

• Circuit current : IDD1 = 30 mA TYP. @ VDD1 = 2.8 V, VDD2 = 3.5 V, VAGC = 2.5 V, Pout = +11 dBm, (0.8 GHz Band side)

: IDD2 = 30 mA TYP. @ VDD3 = 2.8 V, VDD4 = 3.5 V, VAGC = 2.5 V, Pout = +11 dBm, (1.5 GHz Band side)

• Output power : Pout1 = +14 dBm TYP. @ VDD1 = 2.8 V, VDD2 = 3.5 V, VAGC = 2.5 V (0.8 GHz Band side)

: Pout2 = −15 dBm MAX. @ VDD1 = 2.8 V, VDD2 = 3.5 V, VAGC = 0.5 V (0.8 GHz Band side)

: Pout3 = +14 dBm TYP. @ VDD3 = 2.8 V, VDD4 = 3.5 V, VAGC = 2.5 V (1.5 GHz Band side)

: Pout4 = −15 dBm MAX. @ VDD3 = 2.8 V, VDD4 = 3.5 V, VAGC = 0.5 V (1.5 GHz Band side)

• Low distortion : Padj1 = −63 dBc TYP. @ VDD1 = 2.8 V, VDD2 = 3.5 V, VAGC = 2.5 V, Pout = +11 dBm,

f = 925 MHz, Δf = ±50 kHz, 21 kHz Bandwidth (0.8 GHz Band side)

: Padj3 = −63 dBc TYP. @ VDD3 = 2.8 V, VDD4 = 3.5 V, VAGC = 2.5 V, Pout = +11 dBm,

f = 1 441 MHz, Δf = ±50 kHz, 21 kHz Bandwidth (1.5 GHz Band side)

• High-density surface mounting : 14-pin LGA (CSP Type) package (2.5 × 2.5 × 0.6 mm)