FEATURES

− Tx Block −

• Circuit Current (DRV + PA) : I = 160 mA TYP. @ VCC = Vds = 3.0 V, f = 1.9 GHz, Pin = −19 dBm, Pout = +20.5 dBm

• Output Power : Pout = +20.5 dBm MIN. @ VCC = Vds = 3.0 V, f = 1.9 GHz, Pin = −19 dBm

• Power Gain : GP = 39.5 dB MIN. @ VCC = Vds = 3.0 V, f = 1.9 GHz, Pin = −19 dBm

• Adjacent Channel Power : Padj1 = −65 dBc TYP. @ VCC = Vds = 3.0 V, f = 1.9 GHz, Pout = +20.5 dBm, Δ ±600 kHz

: Padj2 = −70 dBc TYP. @ VCC = Vds = 3.0 V, f = 1.9 GHz, Pout = +20.5 dBm, Δ ±900 kHz

• Harmonics Frequency Level : 2f0 = −45 dBc TYP. @ VCC = Vds = 3.0 V, Pout = +20.5 dBm

: 3f0 = −60 dBc TYP. @ VCC = Vds = 3.0 V, Pout = +20.5 dBm

• Gain 1 dB Compression Output Power : PO (1 dB) = +21 dBm TYP. @ VCC = Vds = 3.0 V

− Rx Block −

• Circuit Current : ICC = 11.5 mA TYP. @ VCC = 3.0 V

• Convertion Gain : CG = 21.5 dB TYP. @ fRF = 1.9 GHz, fIF = 240 MHz, fLo = 1.66 GHz

• Noise Figure : NF = 3.1 dB TYP. @ SSB

• Input 3rd Order Distortion : IIP3 = −14.5 dBm TYP. @ fRF1 = 1.9 GHz, fRF2 = 1.9006 GHz, PRF = −35 dBm/tome Intercept Point

• Image Rejection Ratio : IMR = 40 dBc TYP. @ fRF1 = 1.9 GHz, fRF2 = 1.42 GHz, PRF = −35 dBm/tome

• High-density Surface Mounting : 16-pin plastic TSON package (3.3 × 2.3 × 0.6 mm)